Bandwidth2.85-2.95GHz, Rejection40@DC-2.4GHz, 35@3.3-7.0GHz
High precision machining technology
Low temperature drift, high power.
Ceramic substrate, 50 Ω coplanar waveguide
Gold wire bonding
Items | Parameters | Units |
Center Frequency | 2.9 | GHz |
Bandwidth | 2.85-2.95 | GHz |
Center loss | 3.7 | dB |
Ripple | 1.0 | dB |
VSWR | 1.7:1 | |
Group delay ripple | 0.6 | ns |
Rejection | 40@DC-2.4GHz | dBc |
Rejection | 35@3.3-7.0GHz | dBc |
power | 2W CW |
Work Temp. | -55~+85℃ |
Storage Temp. | -55~+125℃ |
Outline size | L:7.0,W:6.0,h:0.39 |
1: 0.1mm from the side wall, 2.62mm from the surface to the upper cover.
2: Suggest using conductive adhesive for bonding;
3: The chip should be installed on kovar alloy or molybdenum copper;
4: Suggest using a T-shaped structure for microstrip bonding.